Multi-wire cutting is a process that involves the high-speed reciprocating motion of metal wires.

Release time：2024-12-12

Multi-wire cutting is a new cutting processing method that uses the high-speed reciprocating motion of metal wires to bring abrasives into the semiconductor processing area for grinding, cutting hard and brittle materials like semiconductors into hundreds of thin slices at once. CNC multi-wire cutting machines have gradually replaced traditional inner circle cutting, becoming the main method for silicon wafer cutting.
The high-precision CNC multi-wire high-speed cutting machine tool, developed based on key technologies for high-precision, high-speed, and low-consumption cutting control, can fully achieve high-precision, high-speed, and low-loss cutting of semiconductor materials and various hard and brittle materials, filling a domestic gap; the results have multiple independent intellectual property rights, and the overall technology has reached an internationally advanced level, with the tension control technology of the cutting wire, the synchronization technology of the take-up and pay-off motors, and the main motor being at the international leading level.
Silicon wafers are the main production materials in the semiconductor and photovoltaic fields. The silicon wafer multi-wire cutting technology is one of the more advanced silicon wafer processing technologies in the world. It is different from traditional cutting methods such as saw blades and grinding wheels, as well as advanced laser cutting and inner circle cutting. Its principle is to use a high-speed moving steel wire to drive the cutting abrasive attached to the wire to rub against the silicon rod, thus achieving the cutting effect. Throughout the process, the steel wire is guided by dozens of guide wheels, forming a wire mesh on the main wire roller, while the workpiece to be processed is fed in by the descent of the workbench. Compared with other technologies, silicon wafer multi-wire cutting technology has advantages such as high efficiency, high production capacity, and high precision. It is the most widely used silicon wafer cutting technology.
Multi-wire cutting technology (MWS: Multi-Wire-Slicing) is an innovative process for cutting brittle and hard materials (such as silicon ingots). In this process, the cutting wire is wound around a guiding shaft, allowing for hundreds of cuts to be made simultaneously, resulting in hundreds of slices.
The MWS process can be further divided into two process branches: one is the traditional, widely used cutting and polishing process, and the other is the new cutting and grinding process. The cutting and polishing process uses an uncoated cutting wire, which is coated with polishing liquid during the cutting process. The cutting and grinding process uses a cutting wire coated with diamond abrasive for cutting, achieving ideal separation effects and greatly improving production efficiency.

Keywords： Multi-wire cutting is a process that involves the high-speed reciprocating motion of metal wires.