The multi-wire cutting machine has the following advantages.

Release time：2024-12-12

Multi-wire cutting technology can be used to cut brittle and hard materials, such as silicon ingots, and can also be used to separate difficult-to-cut materials. This process has the following advantages:
(1) High economic efficiency, capable of cutting hundreds of wafers at once
(2) Can cut silicon ingots with a diameter of up to 300mm
(3) Small depth of crystal defects
(4) Few geometric defects (TTV, bowing, deviation, etc.)
(5) Suitable for separating hard, brittle, or difficult-to-cut materials

Keywords： The multi-wire cutting machine has the following advantages.

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Multi-wire cutting technology can be used to cut brittle and hard materials, such as silicon ingots, and it can also be used to separate difficult-to-cut materials.

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Multi-wire cutting machines are suitable for various fields

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