Focusing on "core" strength to seek development, the SEMI-e 2024 Sixth Shenzhen International Semiconductor Exhibition is about to grandly open!

Release time：2024-12-12

The 6th Shenzhen International Semiconductor Exhibition (referred to as: SEMI-e), hosted by Shenzhen Zhongxin Material Exhibition Co., Ltd. in conjunction with the China Communications Industry Association, Jiangsu Semiconductor Industry Association, Zhejiang Semiconductor Industry Association, Shenzhen Semiconductor Industry Association, and Chengdu Integrated Circuit Industry Association, will grandly open from June 26 to 28 at the Shenzhen International Convention and Exhibition Center (Baoan New Hall) in Halls 4, 6, and 8! With 815 exhibitors and over 50 corporate representatives sharing insights, it aims to build a platform for the upgrading and development of the semiconductor industry chain!
The exhibits cover chip design, wafer manufacturing and packaging, semiconductor special equipment & components, third-generation semiconductors, electronic components, automotive semiconductors/automotive-grade packaging, AI and computing power, algorithms, storage, and CPO packaging.
Three halls and six major areas
Gathering strength to seek development
Shenzhen is an important base for the application of semiconductor and integrated circuit design and manufacturing! In the South China region centered around Shenzhen, there are hundreds of proposed and under-construction projects with investment amounts ranging from hundreds of millions to tens of billions, involving wafer fabs, silicon carbide, sensors, IC packaging, IC substrates, Mini LED displays, automotive semiconductors, artificial intelligence, IoT, and power devices for wind and solar storage.
The third-generation semiconductor industry chain has a significant upstream traction effect, with substrate, epitaxy, and device manufacturing being key links that distinguish it from traditional semiconductor production, where substrate and epitaxy production account for over 60% of costs. In the face of the vast application market for third-generation semiconductors, many companies are actively conducting R&D and production, gradually establishing a relatively complete industry chain from substrate, epitaxy, design, manufacturing, packaging, to application. With the rapid advancement of technology, silicon carbide (SiC) and gallium nitride (GaN), as leaders in the semiconductor materials field, are leading the innovation of a new generation of electronic technology with their performance and broad application prospects. Looking ahead, the market applications of these two materials will continue to expand, driving the electronics industry to a higher stage of development.
Over 50 themed activities
Industry leaders discuss the future
Building on the foundation of the SEMI-e 6th Shenzhen International Semiconductor Exhibition, the "2024 China Automotive Semiconductor Conference", "5th Third Generation Semiconductor Industry Development Summit Forum", "6th Shenzhen Semiconductor Industry Technology Summit", and "2024 Today's Semiconductor Localization Trend Summit" will be held concurrently. Combining the characteristics and development trends of the semiconductor industry, experts, entrepreneurs, and industry elites from the semiconductor field will gather to discuss and share insights on the semiconductor industry landscape, cutting-edge technologies, and market trends.
The conference will focus deeply on the current development status of the Chinese automotive chip industry, the development and application of autonomous driving technology, the application of power devices in the new energy vehicle industry, analysis of the current status and application prospects of GaN/SiC technology, semiconductor packaging topics, and the current status and development trend analysis of semiconductor equipment and core components market.

Keywords： Focusing on "core" strength to seek development, the SEMI-e 2024 Sixth Shenzhen International Semiconductor Exhibition is about to grandly open!